Heat-conductive gels - Simply cool
Modified gels with excellent thermal conductivity optimize the cooling of elemets on any board. Adaptable like a paste, highly flexible, easy to compress and easy to remove: Thanks to their unique surface structure, HeatPath heat-conductive gels considerably reduce heat transfer resistance. Your advantage: Smaller heat sinks can be used, component density can be increased...
Intermediate between liquid and solid. The new intelligent heat conducting technology for electronic boards and components. The contact surface of every electronic component, of every heat sink still has a certain roughness, even if processed most carefully.
Intermediate between liquid and solid
The new intelligent heat conducting technology for electronic boards and components.The contact surface of every electronic component, of every heat sink still has a certain rough- ness, even if processed most carefully. This roughness considerably reduces heat flow. Generations of development engineers have therefore been using thermally conductive pastes or foils which, however, work with high mounting pressure only.
Properties
- Low interfacial thermal resistance
- Excellent thermal conductivity
- Best all- round properties
- The inexpensive solution
- Individual processing
- Clean and easy removal
HeatPath: Low interfacial thermal resistance
HeatPath is new. And it is different. HeatPath consists of a unique modified gel with extraordinary flexibility and surface properties. HeatPath conforms to the contours even of rough surfaces, avoiding air gaps and considerably reducing interfacial thermal resistance. Reversible connection between heat source and heat sink through well-dosed adhesive properties, installable with extremely low mounting pressure.
Excellent thermal conductivity
The modern gel material allows the use of inexpensive but efficient thermally conductive particles such as Al2O3. Thermal conductivity of 0.7 to 1.1 W/mK can thus be achieved.
HeatPath: Best all- round properties
Combining low interfacial resistance with excellent thermal conductivity, HeatPath can be used in a wide range of applications on the fields of electrics and electronics. HeatPath is the first choice when heat shall be carried off reliably.
HeatPath: The inexpensive solution
The new technology makes it possible: Considerable decrease of expenses in electronics production thanks to low material costs and easy processing. HeatPath is installed without any special procedures or tools - without application of heat, glue, or any other preparations.
HeatPath: Individual processing
Whether for the use in research laboratories or in large series: HeatPath thermally conductive gels are available as sheet, tape, or in prestamped shapes. Standard material thickness: 0.25 mm to 4.6 mm.
HeatPath: Clean and easy removal
No more complicated handling with thermally conductive pastes, or destroyed electrical components when pasted heat sinks cannot be removed properly in case of repair. HeatPath peels away completely, just as easily as it has been installed, without any tools, again and again.
